Abstract

The characteristics of InGaP/GaAs heterostructure-emitter bipolar transistors (HEBTs) including conventional GaAs bulk base, InGaAs/GaAs superlattice-base, and InGaAs quantum-well base structures are presented and compared by two-dimensional simulation analysis. Among of the devices, the superlattice-base device exhibits a highest collector current, a highest current gain and a lowest base–emitter turn-on voltage attributed to the increased charge storage of minority carriers in the InGaAs/GaAs superlattice-base region by tunneling behavior. The relatively low turn-on voltage can reduce the operating voltage and collector–emitter offset voltage for low power consumption in circuit applications. However, as to the quantum-well base device, the electrons injecting into the InGaAs well are blocked by the p+-GaAs bulk base and it causes a great quantity of electron storage within the small energy-gap n-type GaAs emitter layer, which significantly increases the base recombination current as well as degrades the collector current and current gain.

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