Abstract
New automotive specifications derived from higher module integration and more stringent environmental requirements expect plastic packages to operate at higher junction temperatures with prolonged duration. Temperature is a key accelerating factor for failures in electronic package devices because of the thermo-mechanical, metallurgical and chemical properties of the materials used in the package. Failures in conventional plastic package at high temperatures such as 175 °C often originate from aluminum – gold wirebonding system because of the formation of Au-Al intermetallic phases and associated Kirkendall voiding which degrades the interface. Methods to overcome such reliability issues in wire bonded devices are to change either the wire material or the bond pad metallurgy or pad finishing other than aluminum which can reliably withstand operations at higher temperature and longer duration.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Microelectronics and Electronic Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
