Abstract
Thermomechanical analysis was used to compare cure conditions of a bisphenol A epoxy resin composition and the same composition prepared with a rigid rod biphenol epoxy resin. The rigid rod system exhibited a lower curing rate and lower thermal expansion than did the bisphenol A system. The glass transition and thermal expansion of the rigid rod system can be varied by manipulation of the ratio of curing agent to epoxy. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 2163–2167, 1998
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