Comparison and validation of thermal contact resistance models at solid–liquid interface taking into account the wettability parameters

Abstract

Two analytical models for thermal constriction resistance prediction at solid–liquid interface have been compared in this study. The wettability parameters (surface tensions and contact angle) have been taken into account in the models. These models have been used in conjunction with a thermal interstitial resistance to improve the prediction of the bulk thermal contact resistance (TCR) at the solid/liquid interface. A relatively good agreement between the predictions and the experimental data has been obtained and the capability of the models to predict the TCR is shown. Therefore, the models have been used to investigate the effect of the contact temperature on the constriction and interstitial resistance. The evolution of the equivalent entrapped air layer thickness with the temperature has been estimated. The results have shown that the TCR and the equivalent air layer thickness decrease when contact temperature increases.