Comparative Thermal and Thermomechanical Analyses of Traditional and Flip Chip Double-Sided Cooling Power Module

Abstract

In comparison to the traditional single-sided cooling (SSC) power module, the double-sided cooling (DSC) power module has gradually become a research hotspot in the electric vehicle (EV) industry. A new Flip chip double-sided cooling (FCDSC) design scheme is proposed in this article, which is adopted Gate-free wire and Pb-free solder, and the Fabrication only needs one reflow. Compared with traditional double-sided cooling (DSC) package forms, the former has better heat dissipation capacity and lower thermo-mechanical stress caused by the mismatched coefficients of thermal expansion (CTE). In this paper, the differences in thermal management and thermomechanical reliability were compared based on finite element analysis (FEA) tool under different power loss and temperature. A parametric study shows that, Compared the FCDSC with the DSC power module, the junction temperature decreased 5.67%, and the thermomechanical stress of IGBT chip decreased 26.34 MPa 31.11%, and the warping of chip is reduced by 1.76μm (15.8%). This study will provide some reference for the development of electric vehicle (EV) implementation.