Abstract
The interfacial adhesion of polyethylene (PE) and polyamide 6 (PA6) was enhanced via reactive compatibilization in a sequential injection molding process through PE+PE-MAH/PA6 bilayer system and PE/tie layer/PA6 sandwich system in this article. The experimental results showed that the crack propagation for sandwich system changed from the adhesive interface to a thin layer in the bulk of PE with increasing molding temperature. More copolymers were in-situ formed at sandwich interface. Therefore, stronger interfacial adhesion of PE/PA6 obtained in sandwich system was presumably attributed to higher interfacial temperature formed at sandwich interface during sequential injection molding process.
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