Abstract

This paper presents the comparative performance of several surrogate‐assisted multiobjective evolutionary algorithms (MOEAs) for geometrical design of a pin‐fin heat sink (PFHS). The surrogate‐assisted MOEAs are achieved by integrating multiobjective population‐based incremental learning (PBIL) with a quadratic response surface model (QRS), a radial‐basis function (RBF) interpolation technique, and a Kriging (KRG) or Gaussian process model. The mixed integer/continuous multiobjective design problem of PFHS with the objective to minimise junction temperature and fan pumping power simultaneously is posed. The optimum results obtained from using the original multiobjective PBIL and the three versions of hybrid PBIL are compared. It is shown that the hybrid PBIL using KRG is the best performer. The hybrid PBILs require less number of function evaluations to surpass the original PBIL.

Highlights

  • An air-cooled heat sink is one of the most effective and popular cooling devices for electronic packages due to its high reliability, simplicity, safety, and low cost

  • This paper presents the comparative performance of several surrogate-assisted multiobjective evolutionary algorithms MOEAs for geometrical design of a pin-fin heat sink PFHS

  • Apart from the two nondominated fronts, real heat sinks currently used in the real world are modelled where there junction temperature and fan pumping power values are calculated

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Summary

Introduction

An air-cooled heat sink is one of the most effective and popular cooling devices for electronic packages due to its high reliability, simplicity, safety, and low cost. It is operated in such a way that the heat sink is attached to a device that needs to be cooled down such as a central processing unit CPU chip. In heat transfer design, increasing thermal performance usually results in an increase of pressure drop across the cooling device. This requires high pumping power and high operating cost. A design process of a heat sink usually has two design objectives that are junction temperature and fan pumping power for this study

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