Comparative evaluation of the shear bond strength of a universal adhesive system in different etching modes and a total etch adhesive system

Abstract

To determine a comparative evaluation between the shear bond strength (SBS) of total etch adhesive system and the SBS of universal adhesive system in various etching techniques. There were made 60 sections of teeth for the laboratory research. The studied samples had been divided into 4 groups (15 samples in each group). The control group of the study was the Adper SingleBond 2 total etch adhesive system. The SingleBondUniversal adhesive system had been used in three comparison groups: the first group was the total etch technique; the second group was selective etch technique; the third group was self-etching techinque. The Zwick Roell Z010 testing machine had been used for the study. The received results were fixed. The statistical data were processed. Comparison of researched groups were performed in pairs using the nonparametric Mann-Whitney U test. In the control group the average value of the shear bond strength (SBS) was 15.01±5.2 MPa, in the first comparison group - 15.6±4.8 MPa, in the second comparison group - 19.7±6.04 MPa, in the third comparison group - 17.9±5.85 MPa. The groups with SingleBondUniversal adhesive system in selective etch technique (19.74 MPa) and self-etching (17.9 MPa) technique had the highest average values of the shear bond strength. The universal adhesive system with total etch technique and the total etch adhesive system had statistically similar data (p≥0.05). The control group with Adper SingleBond 2 total etch adhesive system had the lowest shear bond strength (15.01 MPa). The universal adhesive system had high average values of SBS in all etching techniques. During the comparative evaluation there were established correspondence between average values of SBS of universal adhesive system and SBS of total etch adhesive system. The universal adhesive system in selective etch technique had the highest shear bond strength (SBS) with enamel and dentin.