Abstract
A hairpin bandpass filter with compact feeder structure is proposed for terahertz (THz) applications by using the model of odd-even propagation mode. By employing the three-dimensional integrated through-silicon via (TSV) technology, the proposed filter exhibits an ultra-compact size of only $0.24\times0.028$ mm2 ( $1.38\times 0.16\,\,\lambda _{\mathrm {g}}^{2}$ ). The model of the proposed filter is established and optimized with the HFSS tool based on finite element method. The results of $S$ -parameters reveal that the proposed filter with center frequency at 0.5 THz, exhibits a bandwidth of 0.08 THz with insertion loss of 1.5 dB and reflection loss over 13.4 dB in the passband.
Highlights
The filter is the most important component for the radiofrequency (RF) communication front end [1,2,3,4]
The through-silicon via (TSV) technology has been shown to be a good candidate for miniaturization and integration of passive devices [17,18,19,20,21,22,23,24]
A TSV-based hairpin bandpass filter has been proposed as a well-suited component for THz applications
Summary
The filter is the most important component for the radiofrequency (RF) communication front end [1,2,3,4]. TSV is a vital component of 3-D ICs [25,26, 29, 32], which can extend Moore’s law for several more technology nodes despite the bottleneck of physical size transistor scaling [29] Based on these observations, a TSV-based hairpin bandpass filter has been proposed as a well-suited component for THz applications. A compact TSV-based hairpin bandpass filter for THz applications is proposed. As the traditional design method of the hairpin filter is based on microstrip structure in frequencies lower than THz, there is no prior work investigating the behavior and design process for TSV-based hairpin filters in THz band. The proposed methodology is applicable to other filters based on this geometry
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