Compact thermal model for microchannel substrate with high temperature uniformity subjected to multiple heat sources

Abstract

A compact thermal model was established to model thermal characterization of a rectangular fractal tree-like microchannel substrate with multiple heat sources under a target of high temperature uniformity. Calculation of thermal resistances in the compact model was presented. Convective heat transfer in the fractal tree-like microchannels was discussed as well. The compact thermal model was used to optimize geometrical structure of a fractal tree-like microchannel substrate for achieving temperature uniformity of the heat sources. Meanwhile, a 3-D numerical simulation was conducted to examine the optimized structure. Simulation results showed that the optimized structure is able to obtain good temperature uniformity of the heat sources. Junction temperature deviation of the heat sources is less than 0.3°C.