Abstract
This article describes the single band Planar Inverted F Antenna (PIFA) for movable application. This structure of the antenna comprises of a rectangular patch located on top of the Flame Retardant 4 (FR4) dielectric substrate using Substrate Integrated Waveguide (SIW).The bottom side of the substrate is completely covered by a full ground made up of copper material. The complete measurement of PIFA is 21.72 mm x 18.5 mm x 4mm.This antenna has low profile, small size, and good gain hence it is more suitable for mounting on the cellular phone. The performance of PIFA antenna is represented in terms of return loss, VSWR and gain by using the simulation tool Ansys HFSS.
Highlights
The planar inverted-F antenna (PIFA) is well-liked because of its compressed size and low profile makes more suitable for moveable wireless equipment [1]
Reviews from the previous works established that PIFA has a superior Omni-directional pattern and good impedance matching for several applications [6]
The top radiating patch is connected with ground through via.The fabrication of PIFA antenna is simple because it consists of single dielectric substrate, copper layer for ground and patch with via holes, which is a good benefit for crowd fabrication [14]
Summary
The planar inverted-F antenna (PIFA) is well-liked because of its compressed size and low profile makes more suitable for moveable wireless equipment [1]. A few papers have provided about the working of PIFAs placed on the conducting box of standard size. The PIFA is simple, small in size and provides Omni-directional radiation with good efficiency [3]. Reviews from the previous works established that PIFA has a superior Omni-directional pattern and good impedance matching for several applications [6]. The coaxial probe feed system provides 50 Ω connected with SMA connector and suitable for PIFA and insert on to the top radiating patch. The top radiating patch is connected with ground through via.The fabrication of PIFA antenna is simple because it consists of single dielectric substrate, copper layer for ground and patch with via holes, which is a good benefit for crowd fabrication [14]
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