Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC Circuits

Abstract

For millimeter-wave radar application, a very compact planar W-band Tx/Rx front-end module is proposed in this brief. Its novel planar and integrated design benefits from a electromagnetic bandgap (EBG) packaging and the low temperature co-fired ceramic (LTCC) circuits. The unit cell of the substrate integrated EBG is proposed instead of the traditional machined nail unit cell, and its periodic structure is applied for the electromagnetic compatibility of this W-band front-end. Moreover, there are three LTCC circuits applied in this W-band front-end module, including the microstrip-to-waveguide transition, bandpass filter, and forward-wave directional coupler. Finally, the EBG packaging and LTCC circuits are fabricated. Then, the proposed planar and integrated W-band front-end module is assembled and measured with other active chips. The transmitted power is around 28.5 dBm, and the receive noise figure is around 7.5 dB, which demonstrate the feasibility of such a W-band Tx/Rx front-end module.