Abstract

We demonstrate a compact ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$367 \times 67 \, \mu {\text{m}}^2$</tex-math></inline-formula> ) four-channel wavelength division multiplexer using an arrayed waveguide grating based on multimode interference couplers, and built on a monolithic silicon photonics platform. The design is particularly attractive due to the thin device layer. A semi-numerical approach was used for device design and simulation. Optical measurements were found to be consistent with simulation results. The device channel spacing, 3-dB bandwidth and crosstalk were measured to be 97 GHz, 87 GHz and 9.6 dB, respectively, for the designed wavelength of operation near 1310 nm.

Highlights

  • T HE continuous growth in telecommunication traffic demands communication systems to be efficient, flexible, and high speed

  • We demonstrate an Multimode interference (MMI)-based four-channel arrayed waveguide gratings (AWGs) designed on a monolithic silicon photonics platform with a thin device layer [22]–[24]

  • We design and demonstrate a compact fourchannel wavelength-division multiplexer using an AWG based on MMI couplers

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Summary

INTRODUCTION

T HE continuous growth in telecommunication traffic demands communication systems to be efficient, flexible, and high speed. Conventional AWG structures use power splitters based on wavefront division using free propagation regions (FPRs) [15], [16] The shortcomings of these power splitters are the following: higher insertion loss, non-uniform power splitting, stringent fabrication requirements, and large device footprint [17], [18]. The replacement of FPR power splitters with MMI-based power splitters is considerably favored in terms of device footprint, uniform power distribution among the outputs, and fewer waveguide arrays. They are prone to less phase errors and high throughput (low loss) due to the self-imaging principle [20]. Configuration can be further scaled for future technologies with improved performance figures

DEVICE DESIGN AND SIMULATION
FABRICATION AND CHARACTERIZATION
CONCLUSION

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