Compact low-loss diplexer with stacked 2D and 3D structures using 3D glass-based advanced packaging technology

Abstract

A compact low loss wideband diplexer is introduced by using stacked 2D and 3D structures through 3D advanced packaging and through glass vias (TGV). An inductor is designed by using stacked 2D and 3D structures to reduce the coupling effect between adjacent 2D inductors located in the same layer. It can greatly improve the Q factor yet minimize the chip size. This low loss, small size diplexer is developed by virtue of a modified topology and the proposed stacked 2D and 3D structures. The designed diplexer with a compact size of 1.6 mm × 0.8 mm × 0.25 mm is fabricated using 3D glass-based advanced packaging technology and measured by on-wafer probing. The measured results indicate that it achieves an insertion loss less than 0.8 dB and 0.9 dB and an isolation better than 20 dB and 17.5 dB in the bands of 0.699 GHz-0.960 GHz and 1.71 GHz-2.69 GHz, respectively. In comparison with the previously reported designs, the proposed diplexer shows the superior advantages of smaller size and lower insertion loss.