Abstract
In recent years, calorific power of semiconductor has been increasing. So more compact cooling unit for high power control panel compared with air-forced aluminum fin is desired. We have been developing the new counter flow type cooling unit having inclined radiation fins. In this paper, we have found the shape of the heat exchanger and the layout of the fin for higher cooling performance by using the simple numerical analysis. Further we clarified the reason that the cooling performance of the new cooling unit was better than the conventional cooling unit.
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Schedule a callMore From: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
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