Abstract
This work focuses on the application of compact conduction model (CCM) creation approach to ball grid array (BGA) packages under steady state conditions. The procedure of creating CCM from detailed BGA model is demonstrated. The authors have imposed realistic boundary condition scenarios that are likely to test the boundary condition independence necessary for the compact modeling approach. Results showed acceptable agreement in die temperature and heat flow predictions from simulations using detailed BGA models and their CCM equivalents.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components and Packaging Technologies
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
