Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Abstract

This paper discusses a new approach for building a compact all-in-one matrix converter module based on SiC semiconductors arranged in a common source connection. The used transistors are in the D2PAK package. The design of the module is divided into two parts, namely a power module designed at one-layer aluminum substrate printed circuit board (PCB) to ensure good thermal performance and voltage isolation between the module and heatsink. The second board is responsible for the SiC driving and is mounted at the top of the power PCB and consists of metal-oxide semiconductor field effect transistor (MOSFET) drivers, isolated power supplies, a current direction detection circuit, and current value sensors. In the paper, the proper function of the SiC MOSFET drivers, current direction detection, and current measurement sensors were evaluated. Finally, 3D design together with the final prototype is presented. The modules contain three bidirectional cells for interconnection three input voltage sources and one output phase. The uniqueness and novelty of the presented module are the compactness and easy expandability of the module to achieve higher power outputs and multiphase applications such as five phase machines.