Abstract
A practical fast microvia filling method in copper electroplating is developed with the aid of bottom-localized pre-adsorption of bis(3-sulfopropy)-disulfide (SPS). The pretreatment initiates with accelerator adsorbed at all copper surface. Subsequently, the adsorbed SPS on board surface is broken down by sodium persulfate, but the function of adsorbed SPS at microvia bottom is mostly retained due to the mass transfer limitation. The pre-adsorbed SPS at microvia bottom improves the accumulation of SPS at microvia bottom in electroplating filling, resulting in the speeding up of microvia filling.
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