Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes

Abstract

Semiconductor fabrication involves hundreds of process steps through various manufacturing tools. These processing steps are composed of many manufacturing and inspection steps. Inspection is an important step in the fabrication process to determine whether a process is in or out of control. Abrupt manufacturing or inspection tool excursion can lead to a serious low yield problem. Although commonality analysis is a proven tool for detecting abrupt tool excursion, it has gained only limited success in detecting manufacturing tool excursion outside of inspection tools. Compared with manufacturing tools, only a small number of lots or wafers pass through inspection tools. Therefore, it is difficult to construct a sufficient lot history log for inspection commonality analysis in contrast to that of manufacturing tools. Furthermore, inspection may stress a wafer during its own processing, therefore, the target wafer is changed sequentially or randomly. Accordingly, a lot history is apt to include missing traces, which hinders finding inspection tool excursion effectively. In this paper, we propose a comparative analysis framework for commonality analysis algorithms. Performance measures are suggested. To compare the performance of the algorithms effectively, we use a synthetically generated dataset in a simulation experiment. In addition, we apply the algorithms to a real problem that occurred in the fabrication process. Our proposed algorithm demonstrates superiority over the other commonality analysis algorithms in the experiments.