Abstract
The evaporation of pinned, sessile droplets resting on finite thickness substrates was investigated numerically by extending the combined field approach to include the thermal properties of the substrate. By this approach, the combined effects of the underlying substrate and the evaporative cooling were characterized. The results show that the influence of the substrate on the droplet evaporation depends largely on the strength of the evaporative cooling. When the evaporative cooling is weak, the influence of substrate is also weak. As the strength of evaporative cooling increases, the influence of the substrate becomes more and more pronounced. Further analyses indicated that it is the cooling at the droplet surface and the temperature dependence of the saturation vapor concentration that relate the droplet evaporation to the underlying substrate. This indicates that the evaporative cooling number, Ec, can be used to identify the influence of the substrate on the droplet evaporation. The theoretical predictions by the present model are compared and found to be in good agreement with the experimental measurements. The present work may contribute to the body of knowledge concerning droplet evaporation and may have applications in a wide range of industrial and scientific processes.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
