Abstract
We report on the effects of hydrothermal ageing on the dielectric properties of epoxy-silica composites used for microelectronic packaging. The study was carried out for samples with various degrees of curing. Epoxy compounds were subjected to moisture exposure (standard JEDEC procedures) and consecutive thermal stress (240°C). Changes in the dielectric constant and in the loss factor were measured in the 100 Hz–100 kHz frequency range. It is found that water absorption increases with curing. After ageing the dielectric constant is decreased and the loss factor increased. Cured materials have a higher resistance against hydrothermal ageing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
