Abstract
This paper refers to two whole-field , non-contact experimental techniques：Digital Speckle Pattern Interferometry (DSPI) and Digital Image Correlation (DIC). The former can measure 3-D deformations in nanometric level. The latter can measure small displacement in micrometric level. DSPI needs a phase-shifting setup and rotating the whole device for 3-D deformation measurement. Two CCD cameras will be required recording speckle image simultaneously for 3-D measurement by DIC method. An optical system which is a combination of the two measurement method is proposed in this paper. Digital image correlation setup using one CCD camera for in-plane measurement and digital speckle pattern interferometric setup for out-plane measurement constitutes this measurement system. Three dimensions information of deformation can be recorded simultaneously by one 3-color CCD camera. This system can be used to measure deformation with a small out-plane component and a relatively larger in-plane component.
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