Abstract
This paper describes collimated Ti TiN bilayers which are used as diffusion barriers and adhesion layers for chemical vapour deposition tungsten-filled contacts and vias. The collimator used was a titanium collimator with hexagonal 5 8 inch diameter cells and an aspect ratio of 1.5:1. The manufacturability of this collimated process, where TiN is being sputtered from a non-nitrided target, is shown in terms of bottom and sidewall coverage, sheet resistance non-uniformity, and mechanical as well as in-film particle-particle data.
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