Abstract
Film/substrate structure is a basic structure widely used in microelectronic and materials science and technology. A modified three-parameter (Γ0,σ/σy,t) cohesive model was used to investigate the cleavage fracture under plastic atmosphere. The model was also used to discuss the whole process of the initialization and extension of interface crack between uniform and functional graded metal thin film and ceramic substrate under residual stresses. This model was also used to analyze the interfacial crack extension between enhanced functional graded thin film and substrate. The characteristic of the interfacial crack in graded film/substrate was emphasized.
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