Cofiring of LTCC multilayer assemblies with integrated NTC thermistor temperature sensor layers

Abstract

We have studied the integration of Ni–Co–Zn–Mn spinel NTC thermistor layers into LTCC multilayer modules. Sintering of the cubic spinel Ni0.5Co0.5Zn0.75Mn1.25O4 with addition of 3 wt% Bi2O3 additive at 900 °C resulted in samples with 96% density and with good electrical performance. Thermistor spinel tapes, fabricated using doctor blade tape casting, were stacked with layers of a commercially available low-k dielectric LTCC tape, and cofired at 900 °C. Free or constrained cofiring did not give crack-free multilayer samples. Thermistor layers were then integrated combining the commercial LTCC tape with a Zn titanate-based tape in one multilayer laminate, and error-free multilayer samples with a room-temperature resistivity of ρ298 = (2,9 ± 0.08) kΩcm and a thermistor constant of B = (4280 ± 200) K were obtained. This demonstrates the possibility of cofiring of functional ceramic and low-k LTCC tapes and shows the potential of NTC spinel thermistor layers as temperature sensors integrated in complex LTCC multilayer architectures.