Abstract

CoFe 2O 4 has been demonstrated as a potential spinel coating for protecting the Cr-containing ferritic interconnects. This spinel had an electrical conductivity of 0.85 S cm −1 at 800 °C in air and an average coefficient of thermal expansion (CTE) of 11.80 × 10 −6 K −1 from room temperature to 800 °C. A series of Co–Fe alloys were co-deposited onto the Crofer 22 APU ferritic steel via electroplating with an acidic chloride solution. After thermal oxidation in air at 800 °C, a CoFe 2O 4 spinel layer was attained from the plated Co 0.40Fe 0.60 film. Furthermore, a channeled Crofer 22 APU interconnect electrodeposited with a 40-μm Co 0.40Fe 0.60 alloy film as a protective coating was evaluated in a single-cell configuration. The presence of the dense, Cr-free CoFe 2O 4 spinel layer was effective in blocking the Cr migration/transport and thus contributed to the improvement in cell performance stability.

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