Codes and regulations governing handling, storage, use and release of toxic gases

Abstract

To control the hazards associated with the handling, storage, use and release of toxic gases in the manufacturing process, a number of codes and regulations have been promulgated. At the forefront of these regulations are the Uniform Fire Code (UFC), Article 51, ‘‘Semiconductor Fabrication Facilities Using Hazardous Production Materials,’’ 1985 Edition; UFC Article 80, ‘‘Hazardous Materials,’’ 1987 Revision; and the Toxic Gas Model Ordinance, California Assembly Bill 1021. Article 51 of the UFC is specific for semiconductor wafer fabrication facilities and regulates the storage, handling and use of hazardous production materials. Article 80 of the UFC has a much broader scope and incorporates requirements for prevention, control and mitigation of dangerous conditions related to hazardous materials. As it applies to toxic gases, Article 80 incorporates Article 51 requirements and in addition requires treatment systems to reduce discharge concentrations and mitigate unauthorized releases of toxic gases. The Toxic Gas Model Ordinance is specific to toxic gases and regulates storage, handling and use of toxic gases at new and existing facilities incorporating monitoring and treatment systems should an unauthorized release occur. This paper will focus on these regulations as they apply to toxic gases used by the semiconductor and photovoltaics industries.