Abstract
Metal complexes of the Schiff base ligand, synthesized via condensation p-dimethylamino benzaldehyde with Bis (4-aminoantipyrine) benzene 1, 4-diamine which has synthesized from condensation 1, 4-phenylene diamine and 4-aminoantipyrine, are synthesized from chloride salts of Co (II) and Ni(II) with ligand in ethanol. The metal complexes and ligand are characterized on the basis of elemental analyses, melting point, molar conductance, UV –Visible, FTIR and thermogravimetric analysis. The molar conductance data reveal that the metal chelates of the ligand with Co (II) and Ni (II) are electrolytes. The present results suggested that the Schiff base ligand as tetradentate is coordinated with metal ions through the four nitrogen atoms.
Highlights
Bis Schiff bases are the organic compounds containing two azomethine group (-HC=N-) which coordinator from through it with a metal ion (Zayed et al.,2018)
It has been shown that many of the Schiff bases compounds are catalytic in many different interactions
The thermal stability of many Schiff base complexes was useful for applying them as catalysts in high-temperature reactions (Das, P.,and Linert,W.,2016)
Summary
Bis Schiff bases are the organic compounds containing two azomethine group (-HC=N-) which coordinator from through it with a metal ion (Zayed et al.,2018). The infrared spectra of the ligand and the obtained complexes were recorded using KBr discs on FT-IR 8000 Shimadzu in the range of (400-4000)cm-1. Synthesis of Schiff base ligand (BDBAD): In ethanol solution of bis (4-aminoantipyrine) benzene 1,4-diamine (4.78 g, 0.01mole, 20 mL) was taken in a burette and added dropwise to the ethanolic solution of para dimethylamino benzaldehyde (2.98 g, 0.02 mol, 20 mL), Add five drops of glacial (CH3COOH) with constant stirring for three hours (Saritha Reddy et al, 2011).
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Engineering & Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
