Abstract
Inkjet-printed patterns were formed on a paper substrate using anti-oxidant copper nano-ink for application to disposable electronic devices. To prevent substrate damage, the pattern was flash light sintered under ambient conditions using the multi-pulse technique. Pure copper nanoparticles were coated with 1-octanethiol for oxidation resistance using the dry-coating method. Mixing these with 1-octanol solvent at a concentration of 30 wt% produced the copper nano-ink. Photo paper was used as the substrate. The contact angle between the photo paper and copper nano-ink was 37.2° and the optimal energy density for the multi-pulse flash light sintering technique was 15.6 J/cm2. Using this energy density, the optimal conditions were an on-time of 2 ms (duty cycle of 80%) for three pulses. The resistivity of the resulting pattern was 2.8 × 10−7 Ω∙m. After bending 500 times to a radius of curvature of 30 mm, the relative resistance (ΔR/R0) of the multi-pulse flash light-sintered pattern hardly changed compared to that of the unbent pattern, while the single-pulse-sintered pattern showed dramatic increase by 8-fold compared to the unbent pattern. Therefore, the multi-pulse light sintering technique is a promising approach to produce an inkjet-printed pattern that can be applied to disposable electronic devices.
Highlights
Many studies have focused on flexible electronic devices with flexible substrates [1]
For the case of 16 ms and 0.285 MW, it was observed that Cu nanoparticles did not form ansiyntneerecdk,inwgi.thBaasneedckoinngthsetrsuectoubrseearvmaotinognsth, ewceopcponerclnuadneodpathrtaictlethse(Fsiignugrlee-1pbu,cl)s.eHcoowndeivteior,nfsorvtahreyicnagse poeaf k16pomwsearnadnd0.t2i8m5eM, uWnd, ietrwthaessoabmseerevneedrgthyadteCnusitnya,nseoepmarttoicbleesudnisdunitoatbfleorfmor asinnytenriencgkionngt.hBeapsaedpeorn suthbesstreatoeb.servations, we concluded that the single-pulse conditions varying peak power and time, under the same energy density, seem to be unsuitable for sintering on the paper substrate
We measured the electrical conductivity and durability of the copper patterns formed under the same energy density (15.6 J/cm2)
Summary
Many studies have focused on flexible electronic devices with flexible substrates [1]. Paper, a low-cost flexible substrate, decomposes without producing harmful materials and is suitable for application to disposable electronic devices [6,7]. This substrate has the advantage of being suited to printed electronics [8,9,10,11]. The inkjet printing method has been extensively studied for application in the fields of e-paper [19,20], and smart packaging [21] This method typically uses noble metal ink, such as gold or silver [22], which has high electrical conductivity but is expensive. We used flash light sintering with the multi-pulse technique to enhance the electrical conductivity on a low-cost, paper substrate
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