Abstract
Satu daripada asas utama dalam industri pembuatan elektronik ialah pembuatan papan litar bercetak (PCB). Pembuatan PCB pada masa kini perlu melalui proses kikisan. Ini adalah proses satu hala. Proses cetakan yang dilakukan sebelum proses kikisan adalah penyebab utama kepada kecacatan pada PCB. Setelah PCB dikikis, kecacatan itu, jika ada menyebabkan PCB menjadi tidak berguna lagi. Disebabkan oleh keletihan dan keperluan kecepatan, pemeriksaan secara manual tidak efektif dilakukan untuk memeriksa setiap PCB. Oleh itu, pengilang memerlukan sebuah sistem automatik untuk mengesan kecacatan secara masa nyata yang mungkin berlaku semasa proses percetakan. Kecacatan itu akan dikesan dengan menggunakan algoritma pembezaan imej berasaskan wavelet. Seterusnya, kertas kerja ini mencadangkan satu algoritma untuk pemeriksaan visual PCB secara automatik yang berupaya mengesan dan menyari kecacatan pada PCB. Algoritma ini dijalankan pada resolusi kasar pembezaan imej bertujuan untuk mengesan kawasan kecacatan pada resolusi halus imej PCB yang di periksa. Kata kunci: pengesanan kecacatan; resolusi kasar; wavelets; pemeriksaan PCB One of the backbones in electronic manufacturing industry is the printed circuit board (PCB) manufacturing. Current practice in PCB manufacturing requires an etching process. This process is an irreversible process. Printing process, which is done before the etching process, caused most of the destructive defects found on the PCB. Once the laminate is etched, the defects, if exist would cause the PCB laminate to become useless. Due to the fatigue and speed requirement, manual inspection is ineffective to inspect every printed laminate. Therefore, manufacturers require an automated system to detect the defects online which may occur during the printing process. The defect is detected by utilizing wavelet-based image difference algorithm. Hence, this paper proposes an algorithm for an automated visual PCB inspection that is able to automatically locate and extract any defect on a PCB laminate. The algorithm works on the coarse resolution differenced image in order to locate the defective area on the fine resolution tested PCB image. Key words: defect localization; coarse resolution; wavelets; PCB inspection
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