Co-Ni-Cu/Cu Multilayers Electrodeposited Using a Channel Flow Cell

Abstract

Co-Ni-Cu/Cu multilayers were electrodeposited from a single electrolyte using a flow cell with substrate and counter electrode facing each other across a 3 mm wide channel. Substrates were 25 nm Au/3 nm Cr sputtered on glass, and the electrolyte was sulfamate based. The multilayers exhibited giant magnetoresistance (GMR) of up to ∼7%, but only for Cu layer thicknesses ⩾3 nm. Potentiostatic deposition gave higher GMR values than galvanostatic deposition. Both varying the flow rate and varying the Cu content of the electrolyte influenced the GMR, which decreased with increasing Cu deposition current. While the flow cell gives much improved control over mass transport, cells relying on natural convection give higher GMR. © 2002 The Electrochemical Society. All rights reserved.