Co-Firing of Low- and Middle- Permittivity Dielectric Tapes of Fabricating Low-Temperature Co-Fired Ceramics

Abstract

Herein, we report on the co-firing of a low-K wiring substrate and a middle-K functional substrate in LTCC. Firstly, we researched the sintering behavior and dielectric properties of the low-k wiring substrate comprised by alumina and glass frit with <TEX>${\varepsilon}_r$</TEX>, of <TEX>$\sim7$</TEX> and the middle-k functional substrate comprised by <TEX>$Ba_{5}Nb_{4}O_{15}$</TEX> and glass frit with <TEX>${\varepsilon}_r$</TEX>, of <TEX>$20\sim30$</TEX>. The warpage and delamination between the hetero layers of the low-K and the middle-K composition were also studied. In particular, physical matching of the hetero layers could be possible by adjusting of the sintering properties of the composition. We observed that an introduction of the glass frit to the low- and middle-K substrate gives rise to a minimization of an effect given by separation of the hetero layers, and modification of the fraction of the glass frit accompanied by a variation of the composition could control the sintering behavior and its beginning temperature. In the case of co-firing of the L03 as the low-K wiring substrate composition and the M03 as the middle-K functional substrate composition at <TEX>$875^{\circ}C$</TEX>, we could fabricate a desirable structure of hetero layers without any kinds of structural defects such as separation, warpage, delamination, pore trap, etc. We suppose that the co-firing techniques described in this study would provide a helpful method to fabricate a LTCC multi-functional for the next generation.