Abstract
Strengthening of electrodeposited Au-based materials is achieved by co-electrodeposition with TiO2 nanoparticles dispersed in a sulfide-based gold electrolyte. TiO2 content in the composite film is adjusted by concentration of the TiO2 in the gold electrolyte. Effects of the TiO2 content on surface morphology, crystalline structure and microstructure of the composite film are investigated. Mechanical properties of the Au–TiO2 composite films are evaluated by micro-Vickers hardness and micro-compression tests. The hardness increases from 135 to 207 HV when the TiO2 content is increased from 0 to 2.72 wt%. Specimens used in the micro-compression test are micro-pillars fabricated from the composite film, and the yield strength reaches 0.84 GPa by incorporating 2.72 wt% TiO2 into the film.
Highlights
Electrodeposition methods are widely applied in fabrication of micro-components used in miniaturized electronic devices such as microelectromechanical system (MEMS) devices
In consideration of the sample size effect [13], that is mechanical properties of metallic materials varied along with dimensions of the specimen used in the evaluation, the mechanical properties are evaluated by micro-compression test for application in miniaturized electronic devices
The bath was composed of 18.13 g/L of Au(SO3)2 and additives including ethylenediaminetetraacetic acid (EDTA) and sodium gluconate with pH value of 7.5. 10, 30, and 50 g/L of TiO2 NPs (AEROXIDE® TiO2 P25, Evonik, Essen, Germany) were added into the base electrolyte to form Au–TiO2 composite films with different TiO2 contents
Summary
Electrodeposition methods are widely applied in fabrication of micro-components used in miniaturized electronic devices such as microelectromechanical system (MEMS) devices. For enhancing mechanical properties of electrodeposited Au while keeping the high mass density, the effects of oxide dispersion strengthening [12] could be readily applied by incorporating a small amount of oxide NPs into the electrodeposited film. TiO2 NPs are introduced into the Au matrix composite by co-electrodeposition.
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