Abstract
This article mainly describes the technology related to the CMOS MEMS process platform provided by the Taiwan Semiconductor Research Institute (TSRI), including the process flow, design verification, back-end dicing, and packaging of the CMOS MEMS integrated sensing single chip. The front-end CMOS processes can be a standard 0.35 or 0.18 µm CMOS process, or even a BCD high-voltage process. Some academic designs also utilize this platform for in-house post-CMOS process. Finally, the article also explains in detail the CMOS MEMS design flowchart and implementation method provided by TSRI.
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