Abstract

Plasma processes are known to be prone to inducing damage by charging effects. For CMOS image sensors, this can lead to dark current degradation both in value and uniformity. An in-depth analysis, motivated by the different degrading behavior of two different plasma processes, has been performed in order to determine the degradation mechanisms associated with one plasma process. It is based on in situ plasma-induced charge characterization techniques for various dielectric stack structures (dielectric nature and stack configuration). A degradation mechanism is proposed, highlighting the role of ultraviolet (UV) light from the plasma in creating an electron hole which induces positive charges in the nitride layer at the wafer center, and negative ones at the edge. The trapped charges de-passivate the SiO2/Si interface by inducing a depleted interface above the photodiode, thus emphasizing the generation of dark current. A good correlation between the spatial distribution of the total charges and the value of dark current has been observed.

Highlights

  • The dark noise of CMOS image sensors can be affected by plasma process steps, either by purely electrical stress [1] or by the combination of ultraviolet (UV) photon interaction and electrical stress [2]

  • We have studied how the dark current on a front side illumination (FSI) sensor is linked to the interface damages and the nature of the charges appearing in the pre-metal dielectrics (PMD) stack during the plasma exposition

  • We have seen that an oxygen plasma strip can induce a large increase of the pixel dark current of a FSI CMOS image sensor

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Summary

Introduction

The dark noise of CMOS image sensors can be affected by plasma process steps, either by purely electrical stress [1] or by the combination of ultraviolet (UV) photon interaction and electrical stress [2]. This dark noise degradation is caused by an increase of the dark current non-uniformity into the pixel matrix, or a temporal noise degradation of the pixel MOS. This plasma-induced damage occurring during the sensor process can cause severe yield loss, or even pixel reliability issues. TCAD simulation will illustrate the link between dark current and the results on the dielectrics characterization

Experimental
Degradation Mechanism Hypothesis
Illustration
Experimental Set-Up
Surface Potential Voltage Evolution
Silicon
Silicon Surface Barrier Potential Evolution
Total Charge Measurement
Interface States Density Measurement
Interaction versus
Relation between the PMD
Conclusions
Full Text
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