Abstract
Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins optical and electrical components making packaging and sensor handling challenging. In this work, a local back-side release of the photonic sensor is employed, enabling a separation of the sensing area from the rest of the chip. This approach allows preserving the compatibility of photonic integrated circuits in the front-end of line and metal interconnects in the back-end of line. The sensor is based on a micro-ring resonator and is fabricated on wafer-level using a CMOS technology. We revealed a ring resonator sensitivity for homogeneous sensing of 106 nm/RIU.
Highlights
S ILICON-based photonic biosensors integrated into a semiconductor chip technology can lead to significant advances in point-of-care applications, food diagnostics, and environmental monitoring through the rapid and precise analysis of various substances [1]
Silicon photonic sensors need to be sealed, connected to pumping peripherals, and often bear electrical and optical connections [9]. To tackle this general problem, we developed a novel integration approach to separate the sensing area from the rest of the chip by releasing the silicon photonic sensor from the back-side of the chip
Liquids with a different weight percentage of NaCl ranging from 0wt% to 3wt% were dropped onto the silicon photonic sensor using a pipette
Summary
S ILICON-based photonic biosensors integrated into a semiconductor chip technology can lead to significant advances in point-of-care applications, food diagnostics, and environmental monitoring through the rapid and precise analysis of various substances [1]. There has been an increasing interest in sensors based on photonic integrated circuits (PIC) because they give rise to cost-effective, scalable and reliable on-chip biosensors for a broad market. The PIC technology employs typically silicon-on-insulator (SOI) wafer, which is the most attractive approach from a commercial point of view since it provides a scalable platform for mass production using complementary metal-oxide semiconductor (CMOS) fabrication processes [2].
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