Abstract
Abstract Sensor design and fabrication using industrial IC technologies has the advantages of batch fabrication and on-chip interface circuitry. Sensors made by CMOS or bipolar IC technology have been demonstrated for magnetic, temperature and radiation measurands. Certain thermal, mechanical and chemical sensors can be realized by combining IC technologies with additional, compatible processing. We distinguish the methods of multiple project wafers, single project wafers, post-processing IC chips or wafers, and IC fabrication merged with sensor processing performed before, after, and in-between the regular IC processing steps. This paper is focused on sensor prototypes realized by industrial CMOS IC technology with post-processing micromachining. Examples include thermally excited acoustic resonators, thermoelectric gas flow, infrared, and power sensors, and a thermal conductivity sensor.
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