Abstract
In this paper, a combination of acoustic emission and infrared thermal imaging technology is used to study the defect evolution mechanism of Glass/Epoxy composites with bubbles and delamination defects under the single-shot tensile load. The analysis of the acoustic emission signal consists of the k-means method and principal component analysis (PCA). According to the clustering method, the amplitude and peak frequency of the AE signal are clustered. The results show that the AE signal can be divided into four clusters during the tensile loading process, which correspond to four different damage modes: matrix cracking, fiber/substrate stripping, delamination and fiber breakage. The characteristic frequency range of each damage mode was determined by cluster analysis. The effects of bubble defects and delamination defects on the structural strength of the composites were analyzed by experiments. In addition, the combination of acoustic emission and infrared thermal imaging technology can effectively monitor the defect location and damage trend of composite materials.
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