Abstract
AbstractIn this paper, novel and accurate closed‐form expressions are proposed which represent the per‐unit‐length line‐coupling parameters (mutual impedance and mutual admittance) of coupled on‐chip microstrip interconnects on lossy silicon substrate. The frequency‐dependent mutual admittance is accurately expressed in the fully closed form, based on a conformal mapping approach, while the frequency‐dependent mutual impedance is described by a very simple formula associated with a complex image method. The closed‐form expressions are shown to be in good agreement with the full‐wave solutions, and thus can be implanted into the multiconductor transmission‐line (MTL) equations for modeling silicon‐based integrated circuits. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 43: 495–498, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20513
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