Abstract
A micromechanics model is developed to predict the in-plane effective thermal conductivities of plain-weave fabric composites based on a thermal-electrical analogy. Closed-form solutions of the effective thermal conductivities in the warp and fill directions are presented. In order to affirm the applicability of these solutions, the in-plane effective thermal conductivities of S-glass, E-glass, graphite, and Kevlar-49 plainweave fabric-reinforced epoxy composites are predicted. Excellent agreement is found between the present predictions and published analytical, numerical, and experimental results.
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