Abstract
In order to achieve its primary objectives of heavy-flavour tagging and tau lepton identification, the CLIC vertex detector must precisely reconstruct displaced vertices. This requires accurate determination of the impact parameter and charge of tracks originating from the secondary vertex. Excellent spatial resolution must therefore be provided down to low polar angles, whilst maintaining low occupancy, low mass and low power dissipation. These requirements challenge current technological limits, and demand a broad programme of R&D. A detector concept is currently under development, comprising a hybrid pixel detector of small-pitch readout ASICs implemented in 65nm CMOS technology (CLICpix) combined with ultra-thin sensors. The readout chips are low-power, and power-pulsing is used to reduce further their power dissipation. This enables a forced gas cooling system in the vertex detector region. In this paper, the CLIC vertex detector requirements are reviewed and the current status of R&D on sensors, readout, powering, cooling and supports is presented.
Highlights
Vertex detector requirementsThe vertex detector is designed to provide efficient tagging of heavy quarks by precisely measuring the positions of displaced vertices
⇤Presented at the Instrumentation for Colliding Beam Physics (INSTR14) Conference, Budker Institute of Nuclear Physics, Novosibirsk, Russia, 24 February - 1 March 2014 less than 3% in the innermost silicon sensors, the minimum radius is restricted to ⇡ 30 mm from the beam-axis [3]
Reconstructing events using the particle flow technique [4, 5] is central to the design of the detector. This leads to highly granular electromagnetic and hadronic calorimeters, both of which are inside a 4 T 5 T superconducting solenoid
Summary
The vertex detector is designed to provide efficient tagging of heavy quarks by precisely measuring the positions of displaced vertices. As the innermost sub-system, the vertex detector has the most strict requirements on the material budget: 0.2% of a radiation length (X0) per layer is the target (equivalent to around 200 μm of silicon). This means that a forced-air cooling system is favoured over active cooling elements. In order to mitigate the effects of the beam-induced backgrounds, time slicing of the data should be available to a granularity of 10 ns. This allows events of interest to be pin-pointed within the bunch-trains, which are recorded in their entirety via a triggerless readout
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