Abstract
In the past, soft crystals such as Rubidium Acid Phthalate (RAP), Potassium Acid Phthalate (KAP), and hard crystals such as Lithium Fluoride (LiF) have been cleaved by hand methods with varying degrees of success. The limited demand for thin crystals from 0.08 to 0.8 mm thick did not justify development of machines to perform the cleaving operation. However, the crystal requirements of a large-area spectrometer for x-ray astronomy1 and other specialized optics applications made necessary the development of two cleaving machines for soft and hard crystals, respectively.
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