Abstract
AbstractCleaning with hierarchy of CO2‐based solvents is advantageous from an environmental point of view because CO2 is non‐flammable, virtually inert, and abundant. After cleaning, the only waste stuffs generated are the contaminants that are removed from the cleaned parts. The technology is especially well suited for precision cleaning applications in which parts have intricate geometries or for applications in which parts are sensitive to water or high temperature. This review will first introduce aqueous cleaning concepts and mechanism, which is helpful to understand how to design cleaning systems using high pressure CO2. Recent microelectronic processes for cleaning and rising of circuit wafers using CO2‐based solvents are the main focus of the review. Additional cleaning topics include dry cleaning, separation of dyestuffs, and extraction of contaminations from soils and regeneration of catalysts.
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