Abstract
In machining process of WEDM, the gap phenomena are intricately changed by pulse conditions, materials or thickness of workpieces, and the types of wire electrodes. Moreover, the wire vibrates in narrow gap because of electrostatic force, electromagnetic force, and reaction force by rapid expansion of bubbles generated by discharge, and jet flow of machining fluid. Hence, it has been difficult to observe the gap phenomena directly. On the other hand, SiC single crystal has been developed as a promising material for semiconductor power devices in recent years. Since SiC is optically transparent and electrically conductive, it can be used as the workpiece electrode of WEDM. Hence, WEDM was performed using SiC as the workpiece, and the gap phenomena between wire and workpiece were investigated by direct observation of the gap.
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