Circuit level prediction of device performance degradation due to negative bias temperature stress

Abstract

A circuit level methodology for predicting performance degradations due to negative bias temperature stress is developed in this paper. Degradation mechanism is discussed based on experimental observations. Then, models that consist of a threshold voltage shift and a drain current reduction are developed based on the degradation mechanism. The developed models are implemented into a compact MOSFET model so that we can directly link the local degradation of pMOSFETs’ electrical characteristics to the total circuit performances. The validity of the developed models is confirmed by the good agreement in simulated and measured results of I– V characteristics of pMOSFET in all the transistor working region before and after negative bias temperature stress. Then, circuit performance prediction is carried out for the stressed 199-stage ring oscillator on its waveform and oscillation frequency. Excellent agreements between the experimental results and predicted results are obtained.