Circuit Components Based on New Materials: The Reality of Multitechnology System on Systems Hyperintegration

Abstract

The science fiction of yesterday depicted by such characters as Captain Kirk of space ship Enterprise and Dick Tracey has stretched the minds of researchers and technologists that no longer scaling of feature size predicted by Gordon Moore is seen to adequately provide the measure for future hypeintegration platform. While in the early 1960s Gordon Moore made his famous technology scaling predication, in 1959 the physicist Richard Feynman, foreshadowed that “there’s plenty of room at the bottom,” echoing the emergence of the new nanoscience domain. The want for ever higher density structures including that of the non-volatile memories, coupled with the need for a dramatic increase in on-chip data transfer rate is beginning to shape the future of lumped circuit elements as new composites with unique properties that are not found in nature are beginning to emerge. We are finally confirming Richard Feynman’s vision that it is possible to “arrange the atoms the way we want” and more importantly to manipulate them in ways that on the