Abstract

TTT and CHT curing diagrams for tannin-based adhesives were built by thermomechanical analysis (TMA) by following the in situ hardening directly in a wood joint, and the curve trends observed were similar to those previously observed for synthetic polycondensation resins on lignocellulosic substrates. Of the parameters that most influence the relative position of vitrification and gel curves on the diagrams (i.e., where the influence has been quantified), chief among them is the reactivity of the tannin with formaldehyde and any factor influencing it: thus, the inherent higher reactivity of the A-ring of the tannin (such as in procyanidins versus prorobinetinidins) and the pH of the tannin solution. The percentage formaldehyde hardener has some influence in CHT diagrams, especially for the slower-reacting tannins, but practically no influence in TTT diagrams within the 4–10% formaldehyde range used. As in the case of synthetic polycondensation adhesive resins, regression equations relating the internal bond strength of a wood particleboard, prepared under controlled conditions, with the inverse of the minimum deflection, obtained by constant heating rate TMA of a wood joint during resin cure, have been obtained for the two types of tannins of lower reactivity (profisetinidins/prorobinetinidins) but not for the faster-reacting procyanidin and prodelphinidin tannins. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 3220–3230, 2001

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.