Abstract
In the title solvate, [CuCl(C2H3N3S)(C18H15P)2]·CH3CN, the CuI ion is bonded to two triphenylphosphane ligands, one 1H-1,2,4-triazole-5(4H)-thione ligand via its S atom and one chloride ion in a distorted CuP2SCl tetrahedron. An intramolecular N—H⋯Cl hydrogen bond, which closes an S(6) ring, helps to establish the conformation of the complex. In the crystal, N—H⋯Cl hydrogen bonds and C—H⋯π interactions link the components, generating (110) layers.
Highlights
H atoms treated by a mixture of independent and constrained refinement max = 0.52 e Å3
CuI ion is bonded to two triphenylphosphane ligands, one 1H1,2,4-triazole-5(4H)-thione ligand via its S atom and one chloride ion in a distorted CuP2SCl tetrahedron
This study reports the crystal structure analysis and self-assembly of the tiltle complex base on mixed ligand copper(I) complex containing triphenylphosphosphane (PPh3)
Summary
Chlorido[1H-1,2,4-triazole-5(4H)thione-jS]bis(triphenylphosphane-jP)copper(I) acetronitrile monosolvate Department of Chemistry and Center of Excellence for Innovation in Chemistry, Faculty of Science, Prince of Songkla University, Hat Yai, Songkhla 90112, Thailand
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