Chip to Chip Communication at Three Windows: A Proposed Optical Device to VLSI Industry

Abstract

One way chip to chip communication is proposed in the present paper with respect to the three windows. The principle of realisation is made through optical band gap analysis of 1D photonic structure .The same band gap is originated with the help of FTDT (finite difference time domain method). Finally the outcomes of simulated result inferred that the one way communication with respect to the electronic signal of 1.455 V, 0.95 V and 0.8 V corresponding to the 1st, 2nd and 3rd optical windows respectively. The present device would be inculcated in the VLSI chip, if it could be designed at the industry level of VLSI.