Chip scale packaging techniques for RF SAW devices

Abstract

Wafer-level and chip-scale packaging techniques have been developed for use with surface acoustic wave (SAW) devices. Both techniques incorporate a process for bonding a lithium tantalate RF SAW wafer to a mating wafer using adhesive. The package provides a low loss, hermetic environment for the SAW device resulting in a product size at least three times smaller than competitively packaged products. Results of reliability testing including mechanical, electrical and JEDEC moisture sensitivity level will be presented. An overview of various types of wafer-level and chip-scale packaging technologies used in the electronics industry today will be compared to the processes used to develop packaged SAW devices.